Polish & Sealing Pad - Koch Chemie

The extra soft finishing sponge for fine and even application of varnish products such as 1K-Nano or Lack-Polish grün P1.01. The low height of 23 mm produces lower torsional forces, very good handling and very high stability. The optimized cross-linking (open cell state) and the number of cells contribute to very good hygiene factors. The milled edge allows greater flexibility of the pad to better adapt to contours. The colored non-woven material, suitable for polishing, ensures process reliability. Compression hardness: 4. Abrasiveness: 2.