Micro Cut Pad - Koch Chemie

The high-quality special sponge for removing light scratches, holograms and polishing marks with Micro Cut M3.02 and Micro Cut & Finish P3.01. The low height of 23 mm produces lower torsional forces, very good handling and very high stability. The special density of the foam enables a lasting compression hardness during polishing. The optimized cross-linking (open state of the cells) and the number of cells contribute to a long-lasting high-gloss finish and very good hygiene factors. The milled edge allows greater flexibility of the pad to better adapt to contours. The colored non-woven material, suitable for polishing, ensures process safety. Compression hardness: 10. Abrasiveness: 5.